YCS M.Y DJI Drone RC2 T2 CPU IC Reballing Stencil Soldering Platform
Option:
1. M.Y RC2 soldering magnetic platform.
2. M.Y RC2 positioning plate.
3. M.Y T2 Gen 1 positioning plate.
4. M.Y T2 Gen 2 positioning plate.
5. M.Y RC2 CPU reballing stencil.
6. M.Y T2 Gen 1 RC2 CPU reballing stencil.
7. M.Y T2 Gen 2 RC2 CPU reballing stencil.
8. M.Y DJI 0.12mm comprehensive stencil: for DJI Air 3/Mini 3/3 Pro/4 Pro/5 Pro, Ā BGA153, M1MAK11064, S2/Q2515, BGA96, H6, E3, QCK2524C, E2, BGA2000, PI, H22-A0-RH, D8BFW, F460JEUA, SMB2352, UMW2652, SYNAPTICS.Ā
9. DJI RC Plus stencil 0.15mm.
10. DJI RC Plus/CPU stencil 0.12mm: Snapdragon 865/870 small-SM8250.
11. DJI MAVIC4 stencil 0.12mm.
12. DJI RC RC Plus positioning mold.
13. DJI RC RC Plus/CPU positioning mold.
14. DJI Mavic4 positioning mold.
Features:
1. Professionally Designed: Tailor-made for the DJI drone series, ensuring precise soldering and reballing operations.Ā
2. Versatile Options: Offers multiple versions and components to meet the needs of different drone models and repair requirements.
3. High-Precision Positioning: Includes a positioning plate and magnetic base to ensure precise positioning during soldering.
4. Durable Materials: Utilizes high-quality materials to ensure stability and reliability during long-term use.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
YCS M.Y DJI Drone RC2 T2 CPU IC Reballing Stencil Soldering Platform
YCS M.Y DJI Drone RC2 T2 CPU IC Reballing Stencil Soldering Platform
Option:
1. M.Y RC2 soldering magnetic platform.
2. M.Y RC2 positioning plate.
3. M.Y T2 Gen 1 positioning plate.
4. M.Y T2 Gen 2 positioning plate.
5. M.Y RC2 CPU reballing stencil.
6. M.Y T2 Gen 1 RC2 CPU reballing stencil.
7. M.Y T2 Gen 2 RC2 CPU reballing stencil.
8. M.Y DJI 0.12mm comprehensive stencil: for DJI Air 3/Mini 3/3 Pro/4 Pro/5 Pro, Ā BGA153, M1MAK11064, S2/Q2515, BGA96, H6, E3, QCK2524C, E2, BGA2000, PI, H22-A0-RH, D8BFW, F460JEUA, SMB2352, UMW2652, SYNAPTICS.Ā
9. DJI RC Plus stencil 0.15mm.
10. DJI RC Plus/CPU stencil 0.12mm: Snapdragon 865/870 small-SM8250.
11. DJI MAVIC4 stencil 0.12mm.
12. DJI RC RC Plus positioning mold.
13. DJI RC RC Plus/CPU positioning mold.
14. DJI Mavic4 positioning mold.
Features:
1. Professionally Designed: Tailor-made for the DJI drone series, ensuring precise soldering and reballing operations.Ā
2. Versatile Options: Offers multiple versions and components to meet the needs of different drone models and repair requirements.
3. High-Precision Positioning: Includes a positioning plate and magnetic base to ensure precise positioning during soldering.
4. Durable Materials: Utilizes high-quality materials to ensure stability and reliability during long-term use.
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Option:
1. M.Y RC2 soldering magnetic platform.
2. M.Y RC2 positioning plate.
3. M.Y T2 Gen 1 positioning plate.
4. M.Y T2 Gen 2 positioning plate.
5. M.Y RC2 CPU reballing stencil.
6. M.Y T2 Gen 1 RC2 CPU reballing stencil.
7. M.Y T2 Gen 2 RC2 CPU reballing stencil.
8. M.Y DJI 0.12mm comprehensive stencil: for DJI Air 3/Mini 3/3 Pro/4 Pro/5 Pro, Ā BGA153, M1MAK11064, S2/Q2515, BGA96, H6, E3, QCK2524C, E2, BGA2000, PI, H22-A0-RH, D8BFW, F460JEUA, SMB2352, UMW2652, SYNAPTICS.Ā
9. DJI RC Plus stencil 0.15mm.
10. DJI RC Plus/CPU stencil 0.12mm: Snapdragon 865/870 small-SM8250.
11. DJI MAVIC4 stencil 0.12mm.
12. DJI RC RC Plus positioning mold.
13. DJI RC RC Plus/CPU positioning mold.
14. DJI Mavic4 positioning mold.
Features:
1. Professionally Designed: Tailor-made for the DJI drone series, ensuring precise soldering and reballing operations.Ā
2. Versatile Options: Offers multiple versions and components to meet the needs of different drone models and repair requirements.
3. High-Precision Positioning: Includes a positioning plate and magnetic base to ensure precise positioning during soldering.
4. Durable Materials: Utilizes high-quality materials to ensure stability and reliability during long-term use.
