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Tin Dragging Needle set for Phone FPC Connector Desoldering Repair

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Tin Dragging Needle set for Phone FPC Connector Desoldering Repair

Tin Dragging Needle set for Phone FPC Connector Desoldering Repair

Gold Plated Tin Dragging Needle Set: MECHANIC SW-5S, LANRUI M24, RELIFE TO6, JTX BT1 FPC Connector Reballing Tinning Needle delivers precision soldering for phone motherboard FPC connectors, battery sockets, and IC pads. Ā The copper ball tip ensures even solder application on motherboard pads without scratching Ā or damaging components. Anti-static. Perfect for phone repair, PCB rework, and BGA chip, FPC connector soldering and desoldering.


Options:
1. MECHANIC SW-5S BGA Solder Needle Tip with Anti-Static Handle.Ā 
2. LANRUI M24 Red Copper Tin-Dragging Needle Set.
3. RELIFE TO6 FPC Tin-Dragging Needle Set.
4. JTX BT1 Ball-Tip BGA Tin-Dragging Needle set.

Features
1. Copper ball tip design ā€“ Ensures even, uniform soldering on motherboard pads and FPC connectorsĀ without scratching delicate components.
2. Superior Thermal Materials: Red copper or gold-plated tips ensure rapid heat transfer and non-stick performance, maximizing efficiency in tin application and removal.
3. Carbon Fiber Handle: Lightweight, heat-resistant, and thermally insulated to prevent fatigue during prolonged use.
4. Multi-Specification Configuration: Typically includes 3ā€“5 tips of various sizes to meet diverse repair needs.
5. Versatile Applications: Suitable for tin removal, soldering, and reballing operations on IC chips and precision electronic components.

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From $0.77

Original: $2.19

-65%
Tin Dragging Needle set for Phone FPC Connector Desoldering Repairā€”

$2.19

$0.77

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Description

Gold Plated Tin Dragging Needle Set: MECHANIC SW-5S, LANRUI M24, RELIFE TO6, JTX BT1 FPC Connector Reballing Tinning Needle delivers precision soldering for phone motherboard FPC connectors, battery sockets, and IC pads. Ā The copper ball tip ensures even solder application on motherboard pads without scratching Ā or damaging components. Anti-static. Perfect for phone repair, PCB rework, and BGA chip, FPC connector soldering and desoldering.


Options:
1. MECHANIC SW-5S BGA Solder Needle Tip with Anti-Static Handle.Ā 
2. LANRUI M24 Red Copper Tin-Dragging Needle Set.
3. RELIFE TO6 FPC Tin-Dragging Needle Set.
4. JTX BT1 Ball-Tip BGA Tin-Dragging Needle set.

Features
1. Copper ball tip design ā€“ Ensures even, uniform soldering on motherboard pads and FPC connectorsĀ without scratching delicate components.
2. Superior Thermal Materials: Red copper or gold-plated tips ensure rapid heat transfer and non-stick performance, maximizing efficiency in tin application and removal.
3. Carbon Fiber Handle: Lightweight, heat-resistant, and thermally insulated to prevent fatigue during prolonged use.
4. Multi-Specification Configuration: Typically includes 3ā€“5 tips of various sizes to meet diverse repair needs.
5. Versatile Applications: Suitable for tin removal, soldering, and reballing operations on IC chips and precision electronic components.