PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering
Features :Ā
- Brand: PHONEFIX
- Voltage: 110V / 220V
- Demolition shield temperature adjustment 180ā-220ā
- In addition to CPU side glue temperature 180ā-220ā
- Demolition A8 A9 A10 A11CPU the temperature 230ā-240ā
- Desmearing temperature 180ā-200ā
- Reballing BGA chip temperature 180ā-200ā
- Soldering A8 A9 A10 A11 CPU temperature 190ā-210ā
Optional Types :Ā
- 120X-MAX ( 3-IN-1 ) for iPhone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
- 120C - for iphone 5 6 7 8 motherboard Desoldering Rework Station
- 120CC - Android phones motherboard Desoldering pre-Heating Rework Station
iPhone 6 6S 7 8 / X XS MAX Double Layers Board Pre-heating Desoldering Rework Station, adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear
Product Information
Product Information
Shipping & Returns
Shipping & Returns






PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering
PHONEFIX 120X Pre-Heating Station for IPhone BGA CPU Desoldering
Features :Ā
- Brand: PHONEFIX
- Voltage: 110V / 220V
- Demolition shield temperature adjustment 180ā-220ā
- In addition to CPU side glue temperature 180ā-220ā
- Demolition A8 A9 A10 A11CPU the temperature 230ā-240ā
- Desmearing temperature 180ā-200ā
- Reballing BGA chip temperature 180ā-200ā
- Soldering A8 A9 A10 A11 CPU temperature 190ā-210ā
Optional Types :Ā
- 120X-MAX ( 3-IN-1 ) for iPhone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
- 120C - for iphone 5 6 7 8 motherboard Desoldering Rework Station
- 120CC - Android phones motherboard Desoldering pre-Heating Rework Station
iPhone 6 6S 7 8 / X XS MAX Double Layers Board Pre-heating Desoldering Rework Station, adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear
Original: $45.55
-65%$45.55
$15.94Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Features :Ā
- Brand: PHONEFIX
- Voltage: 110V / 220V
- Demolition shield temperature adjustment 180ā-220ā
- In addition to CPU side glue temperature 180ā-220ā
- Demolition A8 A9 A10 A11CPU the temperature 230ā-240ā
- Desmearing temperature 180ā-200ā
- Reballing BGA chip temperature 180ā-200ā
- Soldering A8 A9 A10 A11 CPU temperature 190ā-210ā
Optional Types :Ā
- 120X-MAX ( 3-IN-1 ) for iPhone X / XS / XS MAX Double Layers Board Pre-heating Rework Station
- 120C - for iphone 5 6 7 8 motherboard Desoldering Rework Station
- 120CC - Android phones motherboard Desoldering pre-Heating Rework Station
iPhone 6 6S 7 8 / X XS MAX Double Layers Board Pre-heating Desoldering Rework Station, adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear




















