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Mechanic XG-Z40 High Synthetic Solder Paste Flux BGA Paint Tin Cream

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Mechanic XG-Z40 High Synthetic Solder Paste Flux BGA Paint Tin Cream

Mechanic XG-Z40 High Synthetic Solder Paste Flux BGA Paint Tin Cream

MECHANIC XGZ40 10CC 183°C Solder Paste for Mobile Phone PCB repair, SMD/BGA reworking, and chip reballing. Mechanic XG-Z40 is a high-viscosity and no-clean solder paste tin cream, Sn63/Pb37, ideal for mobile phone and computer motherboard repairs due to its precision and reliability.


Features:

  1. The BGA flux solder paste is a high viscosity no-clean flux.
  2. It is the mixture of high-quality alloyed powder and resin paste flux.
  3. It can avoid the pale yellow residue, so you are easy to clean the board.
  4. It can be used for PCB, BGA, SMD, PGA reworking.
  5. It can be used for soldering and reballing of computer and phone chips.
  6. It is a necessary material for repairing the mobile phone mainboard.
  7. Help to repair the circuit boards and protect the electronic components.
  8. The solder paste flux can only be sent out by special post mail.


Specification:

  • Item name: Solder Paste Flux
  • Brand: MECHANIC
  • Type: XG-Z40
  • Material: Tin+solder paste
  • Color: As picture shown
  • Alloy: Sn63/Pb37
  • Microns: 25-45um
  • Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm


Package includes:

  • 1pc x MECHANIC BGA Solder Flux
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From $0.35
Mechanic XG-Z40 High Synthetic Solder Paste Flux BGA Paint Tin Cream
$0.35

Product Information

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Description

MECHANIC XGZ40 10CC 183°C Solder Paste for Mobile Phone PCB repair, SMD/BGA reworking, and chip reballing. Mechanic XG-Z40 is a high-viscosity and no-clean solder paste tin cream, Sn63/Pb37, ideal for mobile phone and computer motherboard repairs due to its precision and reliability.


Features:

  1. The BGA flux solder paste is a high viscosity no-clean flux.
  2. It is the mixture of high-quality alloyed powder and resin paste flux.
  3. It can avoid the pale yellow residue, so you are easy to clean the board.
  4. It can be used for PCB, BGA, SMD, PGA reworking.
  5. It can be used for soldering and reballing of computer and phone chips.
  6. It is a necessary material for repairing the mobile phone mainboard.
  7. Help to repair the circuit boards and protect the electronic components.
  8. The solder paste flux can only be sent out by special post mail.


Specification:

  • Item name: Solder Paste Flux
  • Brand: MECHANIC
  • Type: XG-Z40
  • Material: Tin+solder paste
  • Color: As picture shown
  • Alloy: Sn63/Pb37
  • Microns: 25-45um
  • Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm


Package includes:

  • 1pc x MECHANIC BGA Solder Flux

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