Mechanic M35 10CC Nano Flux Paste for mobile phone motherboard BGA chip soldering repair. MECHANIC SF38 10CC Touch Point Flux Paste – non-drip, no-residue contact gel flux with 100% highly adaptive active formula for precise, reliable electronics soldering. Suitable for electronic product motherboard and chip repair and fluxing.

Option:
1. Mechanic M35 Nano flux.
2. Mechanic SF38 touch point flux.
Please note that the paste flux can only be sent out by special post (post mail).

Mechanic M35 Flux Features:
1. Pure formula impurities are free, transparent and delicate in and out.
2. New imported formula, innovation ingredient, challenge Ice extreme purity. 
3. High welding performance, new upgrade, low fogging, cleaning free, good deoxidizing.
4. Tight sealing without leakage, transparent and delicate, double sealing, fine/small/medium needles available.

MECHANIC SF38 Touch Point Flux Paste Features:
1. 100% Highly Adaptive Active Formula. Superior thermal conductivity and solder wetting — ensures strong, reliable solder joints.
2. No Residue – No Cleaning Required. Saves time and eliminates the need for post-soldering cleaning solvents.
3. Jelly-Like Non-Dripping Consistency. Viscosity between liquid and solid — resists dripping, ideal for vertical or inverted operations.
4. Precise Dispensing Control. Apply with needles, toothpicks, or tweezers — accurate placement with no splashing.
5. Low Melting Point & Wide Temperature Range. Works effectively across various soldering conditions — versatile for different applications.
6. Faster & Brighter Solder Joints. Saves 30% rework time — produces clean, shiny solder connections.
7. Efficient Oxide Layer Removal. Excellent wettability for oxide removal — ensures consistent joint quality.
8. Application: Precision electronics soldering, PCB repair, BGA reballing, fine-pitch soldering

Product Parameters:
Name: Mechanic M35 Nano flux paste
Size: 182x30x35MM
Packing: 187x3131MM
Capacity: 10CC
Needle: 3pcs

Package Lists:
3 x Needles
1 x Solder paste