MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm
MECHANIC Heat-Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one-click heating, adjustable from 160°C to 250°C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal.
Features:
1. Employs a professional temperature control curve algorithm with a built-in factory-calibrated program to achieve rapid heating and stable constant-temperature operation, effectively reducing the risk of thermal damage to chips.
2. Supports precise temperature adjustment across a wide range to meet diverse requirements for chip glue removal, solder removal, and general repair tasks; the temperature remains stable without drifting.
3. Enables chip glue removal without the need for traditional hot air guns or soldering irons; after heating, residual adhesive can be easily cleaned away using a brush, making the operation simpler and more efficient.
4. Features an anti-static and leak-proof design, minimizing the risk of damage to precision components during the repair process.
5. Adopts a fully hidden, retractable clamping structure with a flexible adjustment range; this effectively prevents residual glue and debris from entering the internal screw mechanism, ensuring smooth operation, enhanced durability, and ease of cleaning.
6. Provides a precise heating zone that concentrates heat directly onto the chip body, thereby minimizing thermal impact on surrounding components and the PCB—preventing board scorching and pad damage.
7. Compatible with 99% of mainstream chips, CPUs, hard drives, and IC components currently on the market, making it widely applicable for chip glue removal and desoldering repair operations.
Product Specifications:
Brand: MECHANIC
Name: Glue Removal Station
Model: Heat-mini
Net Weight: 77.5g
Gross Weight: 110g
Product Dimensions: 79 x 71 x 21 mm
Package Dimensions: 105 x 80 x 25 mm
Temperature Range: 160–250°C
Packing List: Main unit + Type-C charging cable
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MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm
MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm
MECHANIC Heat-Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one-click heating, adjustable from 160°C to 250°C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal.
Features:
1. Employs a professional temperature control curve algorithm with a built-in factory-calibrated program to achieve rapid heating and stable constant-temperature operation, effectively reducing the risk of thermal damage to chips.
2. Supports precise temperature adjustment across a wide range to meet diverse requirements for chip glue removal, solder removal, and general repair tasks; the temperature remains stable without drifting.
3. Enables chip glue removal without the need for traditional hot air guns or soldering irons; after heating, residual adhesive can be easily cleaned away using a brush, making the operation simpler and more efficient.
4. Features an anti-static and leak-proof design, minimizing the risk of damage to precision components during the repair process.
5. Adopts a fully hidden, retractable clamping structure with a flexible adjustment range; this effectively prevents residual glue and debris from entering the internal screw mechanism, ensuring smooth operation, enhanced durability, and ease of cleaning.
6. Provides a precise heating zone that concentrates heat directly onto the chip body, thereby minimizing thermal impact on surrounding components and the PCB—preventing board scorching and pad damage.
7. Compatible with 99% of mainstream chips, CPUs, hard drives, and IC components currently on the market, making it widely applicable for chip glue removal and desoldering repair operations.
Product Specifications:
Brand: MECHANIC
Name: Glue Removal Station
Model: Heat-mini
Net Weight: 77.5g
Gross Weight: 110g
Product Dimensions: 79 x 71 x 21 mm
Package Dimensions: 105 x 80 x 25 mm
Temperature Range: 160–250°C
Packing List: Main unit + Type-C charging cable
Original: $10.99
-65%$10.99
$3.85Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
MECHANIC Heat-Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one-click heating, adjustable from 160°C to 250°C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal.
Features:
1. Employs a professional temperature control curve algorithm with a built-in factory-calibrated program to achieve rapid heating and stable constant-temperature operation, effectively reducing the risk of thermal damage to chips.
2. Supports precise temperature adjustment across a wide range to meet diverse requirements for chip glue removal, solder removal, and general repair tasks; the temperature remains stable without drifting.
3. Enables chip glue removal without the need for traditional hot air guns or soldering irons; after heating, residual adhesive can be easily cleaned away using a brush, making the operation simpler and more efficient.
4. Features an anti-static and leak-proof design, minimizing the risk of damage to precision components during the repair process.
5. Adopts a fully hidden, retractable clamping structure with a flexible adjustment range; this effectively prevents residual glue and debris from entering the internal screw mechanism, ensuring smooth operation, enhanced durability, and ease of cleaning.
6. Provides a precise heating zone that concentrates heat directly onto the chip body, thereby minimizing thermal impact on surrounding components and the PCB—preventing board scorching and pad damage.
7. Compatible with 99% of mainstream chips, CPUs, hard drives, and IC components currently on the market, making it widely applicable for chip glue removal and desoldering repair operations.
Product Specifications:
Brand: MECHANIC
Name: Glue Removal Station
Model: Heat-mini
Net Weight: 77.5g
Gross Weight: 110g
Product Dimensions: 79 x 71 x 21 mm
Package Dimensions: 105 x 80 x 25 mm
Temperature Range: 160–250°C
Packing List: Main unit + Type-C charging cable
