2UUL BG02 BG03 Universal Reballing Stencil AB with Various Pitch Sizes for Mobile Phone and iPhone X-17 Pro Max Chips Soldering and Repair. 2UUL AB Universal Reballing Stencil with 0.3 0.35 0.375 0.4 0.5 0.5 0.65 spacing and 0.5 0.55 0.6 0.62 0.7 0.75 0.8 0.85 pitch size for most mobile phone chips, such as iPhone CPU, Nand flash, WiFi IC, Baseband IC, Small IC, Power Management IC, etc.

Option:
1. 2UUL BG02 AB Reballing Stencil set. 
2. 2UUL BG03 0.12mm Reballing Stencil.

Features:
1. Multiple Pitch Options: Offers up to 7 A-pitch options (0.3/0.35/0.375/0.4/0.5/0.6/0.65 mm) and 7 B-pitch options (0.5/0.55/0.6/0.62/0.7/0.8/0.85 mm) to meet the needs of different IC types.
2. Includes Blade: Each grid comes with a blade, allowing technicians to easily adjust and cut the grid as needed, ensuring precise ball-bearing operations.
3. Wide Compatibility: Suitable for a wide range of chips including CPUs, NAND, WIFI ICs, Based-DICs, small ICs, and power management ICs, offering excellent compatibility and adaptability.
4. 99% Coverage: Covers most IC packages with only two grid types, saving time and effort and reducing tool change frequency.
5. Precise Design: Precise design ensures accurate alignment during ball bonding, contributing to improved ball-bearing quality and efficiency.
6. 2UUL BG03 0.12mm Reballing Stencil for iPhone 17/Air/17 Pro/17 Pro Max A19 Pro CPU Nand Chips, etc. 

Product Parameters: 
Product Name: BG02/BG03 Universal Reballing Stencil
Net Weight: 14g
Gross Weight: 22g
Product Dimensions: 100x85x0.1mm
Packaging Dimensions: 105x90x1.2mm